Q Q1. True or False Questions (put “T” or “F” below for each questions, each 5 pts)1.1. Compared with series cooling channels, parallel cooling channels lead to a more uniform cooling because of the constant coolant flow rate. 2.__ One disadvantage for series cooling channel design is that there will be a large rise in coolant temperature at the end of the circuits in large parts, which leads to less efficient cooling. 3.The reason that we use alternative cooling devices such as baffles and bubblers is to divert the coolant flow into the areas that would normally lack cooling. 4.To cool slender cores, the high thermal conductivity insert will lead to less temperature variation, compared with the cold air blown. 5.__ For injection molded parts, doubling the wall thickness of the thickest section would quadruples the cooling time. 6.If the Reynolds number Re is smaller than 4000, then the type of flow is turbulent flow.